Semiconductor inspection R&D · Singapore
Rayvia Technologies is an independent R&D partner to semiconductor inspection OEMs. Optical, X-ray, software and AI — from the first feasibility study to a production-ready system your factory can build.
Capabilities
Inspection problems don't respect discipline boundaries. An illumination decision becomes an algorithm problem; a throughput target becomes a motion architecture. We keep all four in the same room.
Surface
Brightfield, darkfield and multi-angle optical inspection for wafer, panel and package. We design the imaging chain end to end — telecentric optics, illumination geometry, sensor selection, stage motion, and the timing that keeps them synchronised at production speed.
Volume
2D radiography and 3D computed tomography for packaging and advanced interconnect — voids, cracks, bridging and misalignment that no optical path can reach. We work the whole chain, including the shielding and safety case that has to pass certification.
Control
Machine control, image pipelines and the operator experience. Deterministic motion and I/O, real-time acquisition, GPU image processing, recipe management, host integration — and the review interface your customers' operators will use every shift for the next decade.
Judgement
Defect detection and classification that survives contact with a real fab. We build for the case that actually occurs — labelled data is scarce, defect classes drift, and a false call costs more than the model saves. Then we get it running on the tool's own hardware.
How we engage
4–8 weeks
Can the defect actually be seen? We prove the contrast mechanism on your samples and give you a signed-off answer before you commit a program.
3–9 months
One subsystem, delivered to specification — an imaging head, a motion architecture, a reconstruction pipeline, a classifier — integrated into your platform.
12–24 months
Concept through qualified prototype, then a documented transfer to your manufacturing team. You own the design, the drawings and the source.
Ongoing
Our engineers inside your program, working under your process, your tooling and your IP terms. Scale up for a push, scale down after release.
Approach
We start at the measurement, not the machine. If the contrast mechanism doesn't exist, no amount of software recovers it — and it is far cheaper to learn that in week three than in month eighteen.
Throughput, uptime, calibration drift, service access and operator error are specified on day one, not discovered at qualification. A tool that only works in our lab isn't a deliverable.
We work in the background. Designs, source, test data and documentation transfer to you, and we don't build a competing product on the back of your program.
Development is a sequence of unknowns being closed. We tell you which ones are still open, what closing them costs, and what happens if one doesn't close.
About
Rayvia Technologies Pte Ltd works with semiconductor inspection OEMs across Asia, Europe and North America. Our engineers come from equipment and metrology backgrounds — people who have shipped tools into fabs, carried the qualification, and taken the 3 a.m. call when one went down.
We are deliberately small and deliberately senior. Every program is staffed with people who have done the thing before.
Contact
The most useful first conversation is a specific one: a defect you're missing, a throughput target you can't hit, a program that has stalled. Send it under NDA and we'll tell you plainly whether we can help.